Intermolecular Wins EuroAsia IC Industry Award For 'R&D Initiative'
Tempus HPC Workflow, which Dramatically Accelerates R&D Learning Cycles, Cited at SEMICON Europa as Example of Innovation in Semiconductor R&D
SAN JOSE, Calif. — Oct. 22, 2008 — Intermolecular, Inc. today announced it won the EuroAsia IC Industry Award in the R&D Initiative category at SEMICON Europa 2008 in Stuttgart, Germany.
Sponsored by EuroAsia Semiconductor, the award recognizes Intermolecular's unique contribution to making semiconductor research and development more cost effective through its Tempus™ High-Productivity Combinatorial™ (HPC) R&D Workflow, which dramatically accelerates the process of generating hard experimental data.
"This R&D Initiative Award is further validation of how our HPC systems and methodologies transform R&D productivity, reduce risk and lower costs," said David Lazovsky, Intermolecular's chief executive officer. "It also underscores the successes we've had helping materials companies, equipment manufacturers and IC makers achieve competitive differentiation."
By harnessing combinatorial technology and performing up to hundreds of separate experiments in parallel, Tempus tools greatly streamline the process of assessing new materials, refining options and testing process parameters and robustness. HPC™ allows for the precise control of the composition at each location on the wafer, enabling new materials and process integration solutions to be discovered in a fraction of the time it takes using traditional one-at-a-time development methods.
The Tempus platform's combinatorial technology allows users to see trends in greater detail and gain a fundamentally better understanding of complex material integration problems. This, in turn, allows them to make better decisions, minimizing risk and maximizing return on R&D investment. As a result, new materials are being qualified for production far faster and with higher confidence by chipmakers, materials developers and equipment companies.
Tempus tools accelerate experimentation and learning through an infrastructure of hardware and software that includes:
— Massively Parallel Processing, which automates and enables rapid execution of multiple experiments
— Throughput-Matched Characterization, which includes fully automated metrology and electrical-test infrastructure to rapidly characterize the physical and electrical performance of developed technologies, and
— Automation and Analysis Informatics software, a comprehensive, secure Web-based system that integrates processing and characterization tools and the data they generate into unified R&D workflows
"We feel strongly about acknowledging the technological achievements of the industry, and these categories and products represent key areas of innovation in the chip manufacturing process," said David Ridsdale, editor in chief of EuroAsia Semiconductor.
Intermolecular General Manager of Europe Patrick Rabinzohn, right,
receives EuroAsia IC award at ceremony during SEMICON Europa.
About Intermolecular
Intermolecular, Inc. delivers High Productivity Combinatorial™ (HPC) technology products and services that enable customers to maximize semiconductor R&D ROI. The company’s Tempus™ HPC™ Platform offers chipmakers, materials suppliers and equipment manufacturers integrated processing, characterization and informatics systems that exponentially accelerate learning in materials discovery, process development and IC device integration.
Customers apply Intermolecular’s technologies in their R&D projects through Collaborative Development Programs (CDPs) with Intermolecular’s multidisciplinary team, or through purchase of Tempus systems, or by licensing of IP developed and qualified by Intermolecular. By leveraging HPC technologies to quickly develop, integrate and electrically test multiple alternative solutions, at minimum cost and risk, customers obtain unique IP and time-to-market advantage.
Founded in 2004, Intermolecular is based in San Jose, California. A more detailed description of the Tempus HPC platform and information about customer projects are available here.
Agency Contact
Jennifer Anselmo
Loomis Group
Tel: 415.882.9494, x330
anselmoj@loomisgroup.com