Vice President Worldwide Sales and Marketing
Mr. Behnke, who joined Intermolecular in October 2009, has more than 25 years of semiconductor industry experience. Most recently he was Corporate Vice President for Process R&D and transfer at Spansion which included development of its proprietary Charge Trapping NOR and NAND technologies. Mr. Behnke’s previous roles at Spansion/AMD included product deployment for its Wireless Business Unit and Director of its Austin Fab 25 wafer fab. Under his leadership, Fab 25 led the development of AMD’s APC/APM technologies. Prior to Spansion/AMD John worked at the Hughes Research Lab in Malibu, California engaged in InP/GaAs HEMT Low Noise Amplifier and radiation hardened SOS development. He earned a B.S. degree in Mechanical Engineering with an Industrial Engineering Minor from Marquette University, and recently completed a Clean Energy program at the University of Texas at Austin. Mr. Behnke holds five U.S. patents.