Intermolecular has developed proprietary test chips that enable the optimization and seamless integration of new materials and processes into advanced devices. These capabilities range from 65nm features processed using advanced optical proximity correction (OPC), to more advanced sub-45nm technology nodes.

Test structures include via chains, serpentines, combs and SWEAT structures for measuring via failure, resistance, leakage, capacitance change for low-k damage, TDDB, VRDB and electromigration. We also offer test chip vehicles for rapid electrical screening of MIM stacks for DRAM and non-volatile memory applications.

Embedded in the Informatics is the e-test architecture, which consists of four key elements, all linked through the Informatics database:

• Wafer layout, test devices and supported test types
• E-test recipe generation, using the information from the chip design
• Test Cell that takes the recipes and feeds them through to the e-test platform via the instrument drivers
• Analysis suite, which takes the log files, results, etc. from the test cell and generates wafer maps and custom reports